Kami: A Platform for High-Level Parametric Hardware Specification and Its Modular Verification
It has become fairly standard in the programming-languages research world to verify functional programs in proof assistants using induction, algebraic simplification, and rewriting. In this paper, we introduce Kami, a Coq library that enables similar expressive and modular reasoning for hardware designs expressed in the style of the Bluespec language. We can specify, implement, and verify realistic designs entirely within Coq, ending with automatic extraction into a pipeline that bottoms out in FPGAs. Our methodology, using labeled transition systems, has been evaluated in a case study verifying an infinite family of multicore systems, with cache-coherent shared memory and pipelined cores implementing (the base integer subset of) the RISC-V instruction set.
Tue 5 Sep Times are displayed in time zone: Greenwich Mean Time : Belfast change
15:00 - 16:10: Tools for VerificationResearch Papers at L1 Chair(s): Nikhil SwamyMicrosoft Research, n.n. | |||
15:00 - 15:23 Talk | Kami: A Platform for High-Level Parametric Hardware Specification and Its Modular Verification Research Papers Joonwon ChoiMassachusetts Institute of Technology, USA, Muralidaran VijayaraghavanMassachusetts Institute of Technology, USA, Benjamin ShermanMassachusetts Institute of Technology, USA, Adam ChlipalaMassachusetts Institute of Technology, USA, A: ArvindMassachusetts Institute of Technology, USA DOI | ||
15:23 - 15:46 Talk | SpaceSearch: A Library for Building and Verifying Solver-Aided Tools Research Papers Konstantin WeitzUniversity of Washington, USA, Steven LyubomirskyUniversity of Washington, USA, Stefan HeuleStanford University, USA, Emina TorlakUniversity of Washington, USA, Michael D. ErnstUniversity of Washington, USA, Zachary TatlockUniversity of Washington, Seattle DOI | ||
15:46 - 16:10 Talk | Local Refinement Typing Research Papers Benjamin CosmanUniversity of California at San Diego, USA, Ranjit JhalaUniversity of California at San Diego, USA DOI |